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MQH-0920CH
MMIC 9-20GHz Quadrature Hybrid
The MQH-0920 is a MMIC 9 GHz – 20 GHz quadrature (90°) hybrid. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional quadrature hybrid technologies. The MQH-0920 is available as a wire bondable chip. Low unit to unit variation allows for accurate simulations using the provided S4P file taken from measured production units. Applications include single sideband upconverters, image rejection downconverters, IQ modulators, balanced amplifiers, microwave correlators, and microwave Butler matrices.
| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 9 to 20 | GHz |
| Isolation | 22 | dB |
| Nominal Phase Shift | 90 | ° |
| Phase Balance | 2 | ° |
| Amplitude Balance | 0.55 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| MQH-0920CH | MMIC 9-20GHz Quadrature Hybrid | CH | REACH RoHS | Released | EAR99 |
The electrical specifications apply at TA=+25°C in a 50Ω system.
| Parameter | Port Configuration | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|---|
| Frequency Range | - | - | 9 | 20 | - | - | - | GHz |
| Amplitude Balance | A | - | 9 | 20 | - | 0.55 | 1.1 | dB |
| Excess Insertion Loss | A | - | 9 | 20 | - | 1 | 2.2 | dB |
| Impedance | A | - | - | - | - | 50 | - | Ω |
| Isolation | A | - | 9 | 20 | 17 | 22 | - | dB |
| Mean Coupling | A | - | 9 | 20 | - | 3 | - | dB |
| Nominal Phase Shift | A | - | 9 | 20 | - | 90 | - | ° |
| VSWR | A | - | 9 | 20 | - | 1.25 | - | - |
| Phase Balance | - | - | 8 | 20 | - | 2 | 10 | ° |
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
| Parameter | Details | Rating |
|---|---|---|
| Dimensions | - | 2.28 x 1.25 mm |
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Port 1 | Input | Port 1 is DC short to port 3 and open to ground. |  |
| Port 2 | 90° Output | Port 2 is DC short to port 4 and open to ground. | |
| Port 3 | 0° Output | Port 3 is DC short to port 1 and open to ground. | |
| Port 4 | Isolated | Port 4 is DC short to port 2 and open to ground. | |
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. | |
| Port 1 | 90° Output | Port 1 is DC short to port 3 and open to ground. | |
| Port 2 | Input | Port 2 is DC short to port 4 and open to ground. | |
| Port 3 | Isolated | Port 3 is DC short to port 1 and open to ground. | |
| Port 4 | 0° Output | Port 4 is DC short to port 2 and open to ground. | |
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. | |
| Port 1 | 0° Output | Port 1 is DC short to port 3 and open to ground. | |
| Port 2 | Isolated | Port 2 is DC short to port 4 and open to ground. | |
| Port 3 | Input | Port 3 is DC short to port 1 and open to ground. | |
| Port 4 | 90° Output | Port 4 is DC short to port 2 and open to ground. | |
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. | |
| Port 1 | Isolated | Port 1 is DC short to port 3 and open to ground. | |
| Port 2 | 0° Output | Port 2 is DC short to port 4 and open to ground. | |
| Port 3 | 90° Output | Port 3 is DC short to port 1 and open to ground. | |
| Port 4 | Input | Port 4 is DC short to port 2 and open to ground. | |
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
General Handling: Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Download : Outline 2D Drawing
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2018-05-01 | Datasheet Initial Release |
| A | 2019-06-01 | Corrected Port Definitions |
| B | 2020-02-01 | Modified Phase Limits |
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