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ATN03-0040PSM
3dB DC-40GHz MMIC Attenuator
The ATN03-0040PSM is a surface mount GaAs MMIC 3dB attenuator in a DFN package. This attenuator is an ideal solution for attenuating a signal and can be used in a wide range of applications. The compact DFN package allows for extreme miniaturization of SMT footprint making this attenuator suitable for low SWaP applications. GaAs MMIC technology provides consistent unit-to-unit performance in a small, low-cost form factor. A 50-ohm match is maintained over the entire operating frequency range.
| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 0 to 40 | GHz |
| Attenuation | 3 | dB |
| Return Loss | 25 | dB |
| Attenuation Flatness | 0.3 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| ATN03-0040PSM | 3dB DC-40GHz MMIC Attenuator | DFN | RoHS REACH | Released | EAR99 |
| EVB-ATN03-0040P | Evaluation Board, 3dB DC-40 GHz Attenuator | EVB | REACH RoHS | Released | EAR99 |
Measured data is de-embedded from evaluation fixture using AFR.
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Evaluation board performance is shown as a proxy for device performance due to fixturing variability over temperature
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the attenuator in a PSM package with a sine wave input applied to pin 2.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Frequency Range | - | 0 | 40 | - | - | - | GHz |
| Attenuation | - | 0 | 40 | - | 3 | - | dB |
| Attenuation Flatness | - | 0 | 40 | - | 0.3 | - | dB |
| Impedance | - | 0 | 40 | - | 50 | - | Ω |
| Return Loss | - | 0 | 40 | 15 | 25 | - | dB |
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| DC Current | 100 | mA |
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
| RF Power Handling | 2 | W |
| Parameter | Details | Rating |
|---|---|---|
| ESD | 1000 to < 2000 Volts | HBM Class 1C |
| Dimensions | - | 2.0 x 1.3 mm |
| Moisture Sensitivity Level | - | MSL 1 |
A top-down x-ray view of the package outline drawing is shown below.
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| GND | Ground | DFN package ground path is provided through the ground paddle. |  |
| Pin 1 | Non-connect (NC) | Pin 1 is not connected internally and can be tied to RF ground. | |
| Pin 2 | Input/Output | Pin 2 and Pin 5 are DC connected to each other and ground through a T-network of resistors. |  |
| Pin 3 | Non-connect (NC) | Pin 3 is not connected internally and can be tied to RF ground. | |
| Pin 4 | Non-connect (NC) | Pin 4 is not connected internally and can be tied to RF ground. | |
| Pin 5 | Input/Output | Pin 2 and Pin 5 are DC connected to each other and ground through a T-network of resistors. | |
| Pin 6 | Non-connect (NC) | Pin 6 is not connected internally and can be tied to RF ground. | |
Download : Outline 2D Drawing Outline 3D Drawing Outline 3D STP
Download : Footprint Drawing
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2023-10-30 | Datasheet Initial Release |
| A | 2025-08-06 | ESD information |
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