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MPD-0R502CH
0.5 - 2 GHz MMIC 2-Way Wilkinson Power Divider/Power Splitter
The MPD-0R502CH is a small footprint MMIC 2-Way Wilkinson power divider/power splitter featuring high isolation. The MPD-0R502CH uses a mix of lumped element and distributed circuits to significantly reduce the footprint while maintaining isolation at low frequencies. It is much smaller than a printed PCB Wilkinson Power Divider/Combiner. It can be used as an equal amplitude/phase power splitter or a power combiner with excellent isolation. Tight fabrication tolerances result in less unit-to-unit variation than traditional power divider technologies, allowing for accurate simulations using the provided S3P file taken from measured production units.
| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 0.5 to 2 | GHz |
| Phase Balance | 0.1 | ° |
| Excess Insertion Loss | 1.1 | dB |
| No. Ways | Wilkinson 1:2 | - |
| Amplitude Balance | 0.02 | dB |
| Isolation | 20 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| MPD-0R502CH | 0.5 - 2 GHz MMIC 2-Way Wilkinson Power Divider/Power Splitter | CH | REACH RoHS | Released | EAR99 |
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Frequency Range | - | 0.5 | 2 | - | - | - | GHz |
| Amplitude Balance | - | 0.5 | 2 | - | 0.02 | - | dB |
| Common Port Return Loss | - | 0.5 | 2 | - | 20 | - | dB |
| Excess Insertion Loss 1 | - | 0.5 | 2 | - | 1.1 | - | dB |
| Impedance | - | 0.5 | 2 | - | 50 | - | Ω |
| Isolation | - | 0.5 | 2 | - | 20 | - | dB |
| Nominal Phase Shift | - | 0.5 | 2 | - | 0 | - | ° |
| Nominal Power Splitting | - | 0.5 | 2 | - | 3 | - | dB |
| Output Return Loss | - | 0.5 | 2 | - | 18 | - | dB |
| Phase Balance | - | 0.5 | 2 | - | 0.1 | - | ° |
[1] Excess Insertion Loss = (Input Port to Common Port Insertion Loss) - 3dB
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| DC Current | 40 | mA |
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
| Parameter | Details | Rating |
|---|---|---|
| ESD | < 250 Volts | HBM Class 0 |
| Dimensions | - | 3.55 x 3.55 mm |
A top-down view of the MPD-0R502CH package outline drawing is shown below. The MMIC Power dividers are passive reciprocal devices allowing either power splitting or power combining.
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| GND | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Pad 1 | Input/Common | The common port is DC short to the other two ports and open to ground. |  |
| Pad 2 | Output 1 | The output 1 port is DC short to the other two ports and open to ground. | |
| Pad 3 | Output 2 | The output 2 port is DC short to the other two ports and open to ground | |
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. Bond wire inductance will improve return loss. Bondwire inductance in the range of 30pH to 200pH will improve performance.
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. Refer to table on page 11 for wirebond recommendation. In circumstances where the chip is more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage
Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Download : Outline 2D Drawing
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2024-08-19 | Initial Release |
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