MFLP-00012CH_Passive GaAs MMIC 9.2 GHz Lowpass Filter

PRE-RELEASE

Device Overview

General Description

The MFLP-00012CH is a passive MMIC surface mount 9.2 GHz lowpass filter that is an ideal solution for small form factor, high rejection filtering. The MFLP-00012CH features a 9.2 GHz 3 dBc cutoff and 25 dB passband return loss. Passive GaAs MMIC technology allows production of smaller filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit-to-unit variation than traditional filter technologies. The MFLP-00012CH is available as a wire-bondable die. Low unit to unit variation allows for accurate simulations using the provided S2P file taken from measured production units.

Download s-parameters here

Features

Low Passband Insertion Loss with Fast Roll-off
25 dB Return Loss
High Stop Band Suppression

Applications

Test and Measurement Equipment
SATCOM
Radar
RF Transceivers

Functional Block Diagram

Part Ordering Options

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MFLP-00012CH	Passive GaAs MMIC 9.2 GHz Lowpass Filter	CH	RoHS REACH	Pre-release	EAR99

Part Number

Description

Package

Green Status

Product Lifecycle

Export Classification

MFLP-00012CH

Passive GaAs MMIC 9.2 GHz Lowpass Filter

RoHS

REACH

Pre-release

EAR99

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MFLP-00012CH	Passive GaAs MMIC 9.2 GHz Lowpass Filter	CH	RoHS REACH	Pre-release	EAR99

Device Overview
Port Configuration and Functions
- Port Diagram
- Port Functions
Revision History
Specifications
Die Mounting Recommendations
- Mounting and Bonding Recommendations
Mechanical Data
- Outline Drawing

Revision History

Revision Code	Revision Date	Comment
G1	2025-04-24	Pre-Release

Port Configuration and Functions

Port Diagram

A top-down view of the MFLP-00012CH package outline drawing is shown below.

Diagram of the port configuration for MFLP-00012CH

Port Functions

Port	Function	Description
Pad	Ground	CH package ground path is provided through the substrate and ground bond pads.
Port 1	Input	Port 1 is DC short to Port 2.
Port 2	Output	Port 2 is DC short to Port 1.

Specifications

Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.

Parameter	Maximum Rating	Unit
Maximum Operating Temperature	100	°C
Maximum Storage Temperature	125	°C
Minimum Operating Temperature	-55	°C
Minimum Storage Temperature	-65	°C

Electrical Specifications

The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the filter in a CH package with a sine wave input applied to Port 1.

Parameter	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc Passband	Temp = 25°C	-	7.11	-	-	-	GHz
3 dBc Passband	Temp = 25°C	-	9.19	-	-	-	GHz
30 dBc Rejection Point	Temp = 25°C	-	10.26	-	-	-	GHz
Center Freq	Temp = 25°C	-	-	-	3.56	-	GHz
Passband Return Loss	Temp = 25°C	-	-	-	25	-	dB
Group Delay	Temp = 25°C	-	-	-	157	-	ps
Impedance	Temp = 25°C	-	-	-	50	-	Ω

Parameter	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc Passband	Temp = 25°C	-	7.11	-	-	-	GHz
3 dBc Passband	Temp = 25°C	-	9.19	-	-	-	GHz
30 dBc Rejection Point	Temp = 25°C	-	10.26	-	-	-	GHz
Center Freq	Temp = 25°C	-	-	-	3.56	-	GHz
Passband Return Loss	Temp = 25°C	-	-	-	25	-	dB
Group Delay	Temp = 25°C	-	-	-	157	-	ps
Impedance	Temp = 25°C	-	-	-	50	-	Ω