MFBA-00003CH_Passive GaAs MMIC 10.10 – 14.10 GHz Bandpass Filter

Device Overview

General Description

The MFBA-00003CH family of passive MMIC bandpass filter die are an ideal solution for small form factor, high rejection filtering. Passive GaAs MMIC technology allows production of smaller filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional filter technologies. The MFBA-00003CH is available as a wire bondable chip. Low unit to unit variation allows for accurate simulations using the provided S2P file taken from measured production units.

Download s-parameters here

Features

Excellent Return Loss
High Stop Band Suppression
Wide Stop Band with Fast Roll-Off

Applications

N/A

Functional Block Diagram

Part Ordering Options

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MFBA-00003CH	Passive GaAs MMIC 10.10 – 14.10 GHz Bandpass Filter	CH	REACH RoHS	Released	EAR99

Part Number

Description

Package

Green Status

Product Lifecycle

Export Classification

MFBA-00003CH

Passive GaAs MMIC 10.10 – 14.10 GHz Bandpass Filter

REACH

RoHS

Released

EAR99

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MFBA-00003CH	Passive GaAs MMIC 10.10 – 14.10 GHz Bandpass Filter	CH	REACH RoHS	Released	EAR99

Device Overview
Port Configuration and Functions
- Port Diagram
- Port Functions
Revision History
Specifications
Die Mounting Recommendations
- Mounting and Bonding Recommendations
Mechanical Data
- Outline Drawing

Revision History

Revision Code	Revision Date	Comment
A	2024-01-05	Updated Production Test Criteria

Port Configuration and Functions

Port Diagram

A top-down view of the MFBA-00003CH package outline drawing is shown below. The MMIC bandpass filters are symmetrical allowing Port 1 or Port 2 to be used as the input.

Diagram of the port configuration for MFBA-00003CH

Port Functions

Port	Function	Description
Pad	Ground	CH package ground path is provided through the substrate and ground bond pads.
Port 1	Input/Output	Port 1 is DC open to ground for the CH package.
Port 2	Input/Output	Port 2 is DC open to ground for the CH package.

Specifications

Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.

Parameter	Maximum Rating	Unit
Maximum Operating Temperature	100	°C
Maximum Storage Temperature	125	°C
Minimum Operating Temperature	-55	mA
Minimum Storage Temperature	-65	°C
Port 1 DC Current	400	mA
Port 2 DC Current	400	mA

Package Information

Parameter	Details	Rating
Dimensions	-	3.10 x 3.10 mm

Electrical Specifications

The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% visually inspected and RF performance is guaranteed by sample testing.

Parameter	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc Passband	Temp = 25°C	10.23	14.08	-	-	-	GHz
3 dBc Passband	Temp = 25°C	9.77	14.37	-	-	-	GHz
30 dBc Rejection Point	Temp = 25°C	8.84	15.46	-	-	-	GHz
Center Freq	Temp = 25°C	-	-	-	12.00	-	GHz
Insertion Loss @ fc	Temp = 25°C	-	-	-	2.1	-	dB
Passband Return Loss	Temp = 25°C	-	-	-	21	-	dB
Group Delay	Temp = 25°C	-	-	-	484	-	ps
Impedance	Temp = 25°C	-	-	-	50	-	Ω
Stopband Suppression	-	17	37	40	44	-	dB
Stopband Suppression	-	0	7	40	80	-	dB

Parameter	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc Passband	Temp = 25°C	10.23	14.08	-	-	-	GHz
3 dBc Passband	Temp = 25°C	9.77	14.37	-	-	-	GHz
30 dBc Rejection Point	Temp = 25°C	8.84	15.46	-	-	-	GHz
Center Freq	Temp = 25°C	-	-	-	12.00	-	GHz
Insertion Loss @ fc	Temp = 25°C	-	-	-	2.1	-	dB
Passband Return Loss	Temp = 25°C	-	-	-	21	-	dB
Group Delay	Temp = 25°C	-	-	-	484	-	ps
Impedance	Temp = 25°C	-	-	-	50	-	Ω
Stopband Suppression	-	17	37	40	44	-	dB
Stopband Suppression	-	0	7	40	80	-	dB