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MEQ3-14ACH
Passive GaAs MMIC 14 GHz Equalizer
The MEQ3-14ACH passive MMIC equalizer die is an ideal solution for compensating for low pass filtering effects in RF/microwave and high speed digital systems. They provide positive slope from DC to 14GHz with DC attenuation options between 3 and 10dB. The unique design offers superior return loss to competitors. GaAs MMIC technology provides consistent unit-to-unit performance in a small, low cost form factor.
| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 0 to 14 | GHz |
| Return Loss | 23 | dB |
| Insertion Loss | 0.5 | dB |
| Insertion Loss at DC | 3 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| MEQ-14CH-KIT | Evaluation Kit, Passive GaAs MMIC Equalizer Family | - | Consult Factory | Released | EAR99 |
| MEQ3-14ACH | Passive GaAs MMIC 14 GHz Equalizer | CH | REACH RoHS | Released | EAR99 |
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% visually inspected and RF performance is guaranteed by sample testing.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Frequency Range | - | 0 | 14 | - | - | - | GHz |
| Insertion Loss | Freq=14GHz | 14 | 14 | - | 0.5 | - | dB |
| Insertion Loss at DC | Freq=0Ghz | 0 | 0 | - | 3 | - | dB |
| Return Loss | Freq=14GHz | 0 | 14 | - | 23 | - | dB |
Equalizer is symmetrical. Reverse measurement is equivalent to forward measurement.
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
| Port 1 DC Current | 40 | mA |
| Port 2 DC Current | 40 | mA |
| Power Handling, at any Port | 30 | dBm |
| Parameter | Details | Rating |
|---|---|---|
| ESD | 250 to < 500 Volts | HBM Class 1A |
| Dimensions | - | 1.25 x 1.25 mm |
A top-down view of the MEQ3-14A CH package outline drawing is shown below. The MEQ equalizers are symmetrical allowing Port 1 or Port 2 to be used as the input.
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Pad 1 | Input/Output | Port 1 is DC connected to ground through a resistor. DC block is required if voltage present. |  |
| Pad 2 | Input/Output | Port 2 is DC connected to ground through a resistor. DC block is required if voltage present. |  |
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Download : Outline 2D Drawing
| Revision Code | Revision Date | Comment |
|---|---|---|
| A | 2024-01-05 | Updated Production Test Criteria |
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