Rev: D | Copyright © 2017 - 2019 Marki Microwave LLC.

General Description

The MEQ12-7ACH passive MMIC equalizer die is an ideal solution for compensating for low pass filtering effects in RF/microwave and high speed digital systems. They provide positive slope from DC to 7GHz with DC attenuation options between 3 and 12dB. The unique design offers superior return loss to competitors. GaAs MMIC technology provides consistent unit-to-unit performance in a small, low cost form factor.

Features

  • DC attenuation options from 3 to 12dB
  • Typical Insertion Loss 0.5dB at 7GHz
  • VSWR < 1.3:1 Over Entire Band

Functional Block Diagram

Block Diagram
Photo of MEQ12-7ACH

Electrical Performance Summary

ParameterTypUnit
Frequency Range0 to 7GHz
Return Loss 29dB
Insertion Loss 0.5dB
Insertion Loss at DC 12dB

Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.

Part Ordering Options

Part NumberDescriptionPackageGreen StatusProduct LifecycleExport Classification
MEQ12-7ACHPassive GaAs MMIC 7GHz EqualizerCH

REACH

RoHS

ReleasedEAR99

Table Of Contents

Typical Performance Plots

Insertion Loss graph for MEQ12-7ACH
RFC Return Loss vs Temperature graph for MEQ12-7ACH
Group Delay graph for MEQ12-7ACH

Specifications

Electrical Specifications

The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the equalizer in a CH package with a sine wave input applied to port 1.

ParameterTest ConditionsMinimum
Frequency
(GHz)
Maximum
Frequency
(GHz)
MinTypMaxUnit
Frequency Range-0 7---GHz
Insertion Loss Freq = 7GHz
7 7-0.5-dB
Insertion Loss at DC Freq = 0GHz
0 0-12-dB
Return Loss Freq = 7GHz
0 7-29-dB

Equalizer is symmetrical. Reverse measurement is equivalent to forward measurement.

Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.

ParameterMaximum RatingUnit
Maximum Operating Temperature 100°C
Minimum Operating Temperature -55°C
Minimum Storage Temperature 125°C
Minimum Storage Temperature -65°C
Port 1 DC Current 40mA
Port 2 DC Current 40mA
Power Handling, at any Port 30dBm

Package Information

ParameterDetailsRating
ESD250 to < 500 VoltsHBM Class 1A
Dimensions-1.25 x 1.25 mm

Port Configuration and Functions

Port Diagram

A top-down view of the MEQ12-7A CH package outline drawing is shown below. The MEQ equalizers are symmetrical allowing Port 1 or Port 2 to be used as the input.

Diagram of the port configuration for MEQ12-7ACH

Port Functions

PortFunctionDescriptionDC Equivalent
Circuit
PadGround CH package ground path is provided through the substrate and ground bond pads.Equivalent circuit for the Ground
Pad 1Input/Output Port 1 is DC connected to ground through a resistor. DC block is required if voltage present.Equivalent circuit for the Input/Output
Pad 2Output/Input Port 2 is DC connected to ground through a resistor. DC block is required if voltage present.Equivalent circuit for the Output/Input

Die Mounting Recommendations

Mounting and Bonding Recommendations

General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.

Bonding Diagram

Me Q12 7 Ach Bonding Diagram

Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity

GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.

Mechanical Data

Outline Drawing

Download : Outline 2D Drawing

Outline Drawing

Revision History

Revision CodeRevision DateComment
-2017-11-01Datasheet Initial Release
A2018-08-01Evaluation Kit: MEQ7CH-KIT
B2019-03-01Updated ESD Rating
C2019-05-01Added Chip Dimension Tolerance Spec
D2019-08-01Added signal pad dimensions call-out, updated tolerance spec

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