| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 0 to 67 | GHz |
| Pick-Off Loss | 15.2 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
Sales: 408-778-9952 | General: 408-778-4200 | Fax: 408-778-4300
Sales & Customer Support: [email protected]
Tech Support: [email protected]
PT-0067CH
RESISTIVE DC - 67 GHz PICK-OFF TEE
General Description
The PT-0067CH is a broadband DC to 67 GHz pick-off tee featuring a 15 dB pick-off loss and 1 dB through line insertion loss. A pick off tee is a resistive circuit that provides non-directional coupling of microwave signals. In an extremely well-matched system, the PT-0067CH can provide extremely broadband signal monitoring in a very small package. Due to reflections, a directional coupler is typically preferred over a pick off tee for most applications.
Features
- Broadband (DC – 67 GHz)
- Flat 15 dB pick-off loss
- Excellent pick-off flatness near DC
- Small package size
Functional Block Diagram
Electrical Performance Summary
Part Ordering Options
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| PT-0067CH | RESISTIVE DC - 67 GHz PICK-OFF TEE | CH | RoHS REACH | Released | EAR99 |
| PT-0067KGD | Known Good Die, RESISTIVE DC - 67 GHz PICK-OFF TEE | CH | RoHS REACH | Released | EAR99 |
Table Of Contents
Typical Performance Plot
The pick-off port was connected to an external TL with GSG & wire bonds to characterize the chip. The through line directly RF probed.
.png)
.png)
.png)
Specifications
Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% visually inspected and RF performance is guaranteed by sample testing.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Frequency Range | - | 0 | 67 | - | - | - | GHz |
| Direct Line Insertion Loss | Configuration A, Temp = 25°C | 0 | 67 | - | 1.1 | - | dB |
| Pick-Off Loss | Configuration A, Temp = 25°C | 0 | 67 | - | 15.2 | - | dB |
| Pick-Off Return Loss | Configuration A, Temp = 25°C | 0 | 67 | - | 4 | - | dB |
| Through Line Return Loss | Configuration A, Temp = 25°C | 0 | 67 | - | 21 | - | dB |
Absolute Maximum Ratings
| Parameter | Maximum Rating | Unit |
|---|---|---|
| Maximum Operating Temperature | 100 | °C |
| Minimum Operating Temperature | -55 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Storage Temperature | -65 | °C |
| Average Power Handling 1 | 2 | W |
| Thru Line Input to Output Current Handling | 500 | mA |
| Input/Output Port to Pick-Off Port Current Handling | 30 | mA |
[1] Tested RF fixed @ 4 GHz
Package Information
| Parameter | Details | Rating |
|---|---|---|
| ESD | 1000 to < 2000 Volts | HBM Class 1C |
| Dimensions | - | 0.60 x 0.60 mm |
Port Configuration and Functions
Port Diagram
A top-down view of the PT-0067CH package outline drawing is shown below.
Port Functions
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the ground paddle. |  |
| Pad 1 | Input | The input port is DC short to the output port and open to ground. | - |
| Pad 2 | Output | The output port is DC short to the input port and open to ground. | - |
| Pad 3 | Pick-Off | The pick-off port is DC connected to a 50 Ω load. | - |
Die Mounting Recommendations
Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. Bond wire inductance will improve return loss. Bondwire inductance in the range of 30pH to 200pH will improve performance.
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
Bonding Diagram
Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Mechanical Data
Outline Drawing
Download : Outline 2D Drawing
Revision History
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2025-09-02 | Initial Release |
DISCLAIMER
MARKI MICROWAVE, LLC., (“MARKI”) PROVIDES TECHNICAL SPECIFICATIONS AND DATA (INCLUDING DATASHEETS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, AND OTHER INFORMATION AND RESOURCES “AS IS” AND WITH ALL FAULTS. MARKI DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT.
These resources are intended for developers skilled in the art designing with Marki products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards and other requirements. Marki makes no guarantee regarding the suitability of its products for any particular purpose, nor does Marki assume any liability whatsoever arising out of your use or application of any Marki product.
Marki grants you permission to use these resources only for development of an application that uses Marki products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Marki intellectual property or to any third-party intellectual property. Marki reserves the right to make changes to the product(s) or information contained herein without notice.
MARKI MICROWAVE, M wave logo, FastSwitch, and T3 MIXER are trademarks or registered trademarks of Marki Microwave, LLC. All other trademarks used are the property of their respective owners.
© 2025, Marki Microwave, LLC