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MDPX-2734CH
Passive MMIC 0 - 60 GHz High Frequency Diplexer
The MDPX-2734 is a broadband passive MMIC diplexer, a combination high pass and loss pass filter, capable of multiplexing low frequency DC to 27GHz and high frequency 34 to 60GHz signals. Passive GaAs MMIC technology allows production of smaller filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional filter technologies. The MDPX-2734 is available as a wire bondable chip. Low unit to unit variation allow for accurate simulations using the provided S3P file taken from measured production units.
| Parameter | Typ | Unit |
|---|---|---|
| 30 dBc Low Pass Rejection Point | 45 | dB |
| 1 dBc High Passband | 34 to 60 | GHz |
| 1 dBc Low Passband | 0 to 27 | GHz |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| MDPX-2734CH | Passive MMIC 0 - 60 GHz High Frequency Diplexer | CH | REACH RoHS | Released | EAR99 |
Specifications guaranteed +25°C for chip (CH) package, measured in a 50Ω system.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| 30 dBc Low Pass Rejection Point | DC to 17 GHz | 0 | 17 | 27 | 45 | - | dB |
| Common Port Return Loss | 34 to 60 GHz | 34 | 60 | 10 | 16 | - | dB |
| Common Port Return Loss | DC to 27 GHz | 0 | 27 | 10 | 21 | - | dB |
| High Pass Filter, Pass Band Insertion Loss | 34 to 60 GHz | 34 | 60 | - | 0.9 | - | dB |
| High Pass Filter, Pass Band Return Loss | 34 to 60 GHz | 34 | 60 | 10 | 15 | - | dB |
| Impedance | - | - | - | - | 50 | - | Ω |
| Isolation | 16 to 27 GHz | 16 | 27 | - | 20 | - | dB |
| Isolation | 34 to 42 GHz | 34 | 42 | - | 17 | - | dB |
| Isolation | 42 to 60 GHz | 42 | 60 | 26 | 33 | - | GHz |
| Isolation | DC to 16 GHz | 0 | 16 | 25 | 38 | - | dB |
| Low Pass Filter, Pass Band Insertion Loss | DC to 27 GHz | 0 | 27 | - | 0.5 | - | dB |
| Low Pass Filter, Pass Band Return Loss | DC to 27 GHz | 0 | 27 | 10 | 23 | - | dB |
| Low Pass Filter, Stop Band Rejection | 43 to 60 GHz | 43 | 60 | 27 | 33 | - | dB |
| 1 dBc High Passband | - | - | - | 34 | - | 60 | GHz |
| 1 dBc Low Passband | - | - | - | 0 | - | 27 | GHz |
| Parameter | Maximum Rating | Unit |
|---|---|---|
| Maximum Storage Temperature | 125 | °C |
| Maximum Survivable Operating Temperature | 125 | °C |
| Minimum Storage Temperature | -65 | °C |
| Minimum Survivable Operating Temperature | -65 | °C |
| RF Power Handling | 30 | dBm |
| Spec Guaranteed Operating Temperature | 25 | °C |
| Parameter | Details | Rating |
|---|---|---|
| Dimensions | - | 2.28 x 1.25 mm |
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| GND | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Pad 1 | RF Low Band | Pad 1 is DC short to Pad 3 and open to Pad 1. |  |
| Pad 2 | RF High Band | Pad 2 is DC open to Pad 1 and Pad 3. |  |
| Pad 3 | Common/Input | Pad 3 is DC short to Pad 1 and open to Pad 2. | |
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
General Handling: Chips should be handled with a vacuum collet when possible, or with sharp tweezers using well trained personnel. The surface of the chip is fragile and should not be contacted if possible.
Static Sensitivity: GaAs MMIC devices are subject to static discharge, and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Download : Outline 2D Drawing
Notes:
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2017-02-01 | Datasheet initial Release |
| A | 2019-05-01 | Added more Insertion Loss charts |
| B | 2023-12-19 | Updated dimensions on outline drawing. |
DATA SHEET NOTES:
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
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