MDPX-0305CH_Passive MMIC 3 GHz Diplexer/Reflectionless Filter

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MDPX-0305CH	Passive MMIC 3 GHz Diplexer/Reflectionless Filter	CH	REACH RoHS	Released	EAR99

Part Number	Description	Package	Green Status	Product Lifecycle	Export Classification
MDPX-0305CH	Passive MMIC 3 GHz Diplexer/Reflectionless Filter	CH	REACH RoHS	Released	EAR99

Revision History

Revision Code	Revision Date	Comment
-	2021-07-01	Datasheet initial Release
A	2022-03-01	CH Wire Bondable Die Added

Port Configuration and Functions

Port Diagram

Based on the top-down view of the MDPX-0305CH on the previous page. The MDPX-0305CH can be used as a Diplexer, reflectionless LPF, or reflectionless HPF depending on the configuration of each port which can be seen below in the Configuration Array. For configuration A, input to the diplexer is port 1, port 2 will be the output after passing through the HPF, port 3 will be terminated with port 3R, port 4 will be the output after passing through the LPF. Please see Bonding Diagram For Configuration A to see proper wire bonding arrangement.

Diagram of the port configuration for MDPX-0305CH

Port Functions

Configuration A - Diplexer 1

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	Input/common	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	RF High Band	Port 2 is DC short to ground and open to all other ports.
Pad 3	Terminated	Port 3 is DC short to ground and open to all other ports.
Pad 4	RF Low Band	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Configuration B - Diplexer 2

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	RF Low Band	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	Terminated	Port 2 is DC short to ground and open to all other ports.
Pad 3	RF High Band	Port 3 is DC short to ground and open to all other ports.
Pad 4	Input/common	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Configuration C - Reflectionless HPF 1

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	Input/common	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	RF High Band	Port 2 is DC short to ground and open to all other ports.
Pad 3	Terminated	Port 3 is DC short to ground and open to all other ports.
Pad 4	Terminated	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Configuration D - Reflectionless HPF 2

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	Terminated	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	Terminated	Port 2 is DC short to ground and open to all other ports.
Pad 3	RF High Band	Port 3 is DC short to ground and open to all other ports.
Pad 4	Input/common	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Configuration E - Reflectionless LPF 1

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	Input/common	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	Terminated	Port 2 is DC short to ground and open to all other ports.
Pad 3	Terminated	Port 3 is DC short to ground and open to all other ports.
Pad 4	RF Low Band	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Configuration F - Reflectionless LPF 2

Port	Function	Description
GND	Ground	CH package ground path is provided through the substrate and ground bond pads.
Pad 1	RF Low Band	Port 1 is DC short to Port 4 and open to the other two ports and ground.
Pad 2	Terminated	Port 2 is DC short to ground and open to all other ports.
Pad 3	Terminated	Port 3 is DC short to ground and open to all other ports.
Pad 4	Input/common	Port 4 is DC short to Port 1 and open to the other two ports and ground.

Specifications

Absolute Maximum Ratings

Parameter	Maximum Rating	Unit
Maximum Storage Temperature	100	°C
Maximum Survivable Operating Temperature	100	°C
Minimum Storage Temperature	-65	°C
Minimum Survivable Operating Temperature	-65	°C
RF Power Handling	30	dBm
Spec Guaranteed Operating Temperature	25	°C

Package Information

Parameter	Details	Rating
Dimensions	-	1.38x1.25 mm

Electrical Specifications

Specifications guaranteed +25°C for UB package, measured in a 50Ω system.

Parameter	Port Configuration	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc High Passband	-	-	-	-	5	-	26.5	GHz
1 dBc Low Passband	-	-	-	-	0	-	3	GHz
30 dBc Low Pass Rejection Point	-	2.5 to 5 GHz	2.5	5	-	15	-	dB
30 dBc Low Pass Rejection Point	-	DC to 2.5 GHz	0	2.5	25	41	-	dB
Common Port Return Loss	-	5 to 26.5 GHz	5	26.5	10	20	-	dB
Common Port Return Loss	-	DC to 3 GHz	0	3	10	25	-	dB
High Pass Filter, Pass Band Insertion Loss	-	5 to 26.5 GHz	5	26.5	-	0.9	-	dB
High Pass Filter, Pass Band Return Loss	-	5 to 26.5 GHz	5	26.5	10	20	-	dB
Impedance	-	-	-	-	-	50	-	Ω
Isolation	-	16 to 26.5 GHz	16	26.5	25	45	-	dB
Isolation	-	5 to 16 GHz	5	16	30	47	-	dB
Isolation	-	DC to 2.5 GHz	0	2.5	25	40	-	dB
Low Pass Filter, Pass Band Insertion Loss	-	DC to 3 GHz	0	3	-	1	-	dB
Low Pass Filter, Pass Band Return Loss	-	DC to 3 GHz	0	3	10	25	-	dB
Low Pass Filter, Stop Band Rejection	-	16 to 26.5 GHz	16	26.5	20	40	-	dB
Low Pass Filter, Stop Band Rejection	-	5 to 16 GHz	5	16	25	45	-	dB

Parameter	Port Configuration	Test Conditions	Minimum Frequency (GHz)	Maximum Frequency (GHz)	Min	Typ	Max	Unit
1 dBc High Passband	-	-	-	-	5	-	26.5	GHz
1 dBc Low Passband	-	-	-	-	0	-	3	GHz
30 dBc Low Pass Rejection Point	-	2.5 to 5 GHz	2.5	5	-	15	-	dB
30 dBc Low Pass Rejection Point	-	DC to 2.5 GHz	0	2.5	25	41	-	dB
Common Port Return Loss	-	5 to 26.5 GHz	5	26.5	10	20	-	dB
Common Port Return Loss	-	DC to 3 GHz	0	3	10	25	-	dB
High Pass Filter, Pass Band Insertion Loss	-	5 to 26.5 GHz	5	26.5	-	0.9	-	dB
High Pass Filter, Pass Band Return Loss	-	5 to 26.5 GHz	5	26.5	10	20	-	dB
Impedance	-	-	-	-	-	50	-	Ω
Isolation	-	16 to 26.5 GHz	16	26.5	25	45	-	dB
Isolation	-	5 to 16 GHz	5	16	30	47	-	dB
Isolation	-	DC to 2.5 GHz	0	2.5	25	40	-	dB
Low Pass Filter, Pass Band Insertion Loss	-	DC to 3 GHz	0	3	-	1	-	dB
Low Pass Filter, Pass Band Return Loss	-	DC to 3 GHz	0	3	10	25	-	dB
Low Pass Filter, Stop Band Rejection	-	16 to 26.5 GHz	16	26.5	20	40	-	dB
Low Pass Filter, Stop Band Rejection	-	5 to 16 GHz	5	16	25	45	-	dB

Typical Performance Plots

Insertion Loss (dB) graph for MDPX-0305CH

Adjacent Isolation (dB) graph for MDPX-0305CH

Band 1 Group Delay (ps) graph for MDPX-0305CH

Mechanical Data

Outline Drawing

Download : Outline 2D Drawing

Notes:

CH substrate is .004 thick GaAs.
I/O trace is 5 microns Au. Ground is 4 microns Au.
Tolerance for X, Y dimensions is ± 0.002 in.
Tolerance for Z dimension is ± 0.0005 in.

Tolerance for pad location is ± 0.0001 in.

MDPX-0305CH

Device Overview

General Description

Features

Applications

Functional Block Diagram

Part Ordering Options

Table Of Contents