| Parameter | Typ | Unit |
|---|---|---|
| 1 dBc High Passband | 17.4 to 20.3 | GHz |
| 1 dBc Low Passband | 13.2 to 15.4 | GHz |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
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MDPX-00001CH
Passive MMIC Duplexer
General Description
The MDPX-00001CH is a broadband passive MMIC duplexer, a combination of two bandpass filters, capable of multiplexing low band 13.2 to 15.4 GHz and high band 17.4 to 20.3 GHz signals. Passive GaAs MMIC technology allows production of smaller filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit-to-unit variation than traditional filter technologies. Low unit to unit variation allows for accurate simulations using the provided S3P file taken from measured production units.
Features
- 16.8 GHz Crossover Point
- Low <2dB Typical Insertion Loss in Passband
- High Stop Band Suppression
- Excellent Return Loss
Functional Block Diagram
Electrical Performance Summary
Part Ordering Options
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| MDPX-00001CH | Passive MMIC Duplexer | CH | RoHS REACH | Released | EAR99 |
Table Of Contents
Typical Performance Plots
Specifications
Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% visually inspected and RF performance is guaranteed by sample testing.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| 1 dBc High Passband | - | - | - | 17.4 | - | 20.3 | GHz |
| 1 dBc Low Passband | - | - | - | 13.2 | - | 15.4 | GHz |
| 3 dBc High Passband | - | - | - | 17.2 | - | 20.8 | GHz |
| 3 dBc Low Passband | - | - | - | 13 | - | 15.7 | GHz |
| Common Port Return Loss | - | 17.4 | 20.3 | - | 23 | - | dB |
| Common Port Return Loss | - | 13.2 | 15.4 | - | 21 | - | dB |
| Group Delay, High Band | - | 17.4 | 20.3 | - | 360 | - | ps |
| Group Delay, Low Band | - | 13.2 | 15.4 | - | 473 | - | ps |
| High Band Center Frequency | - | - | - | - | 18.8 | - | GHz |
| High Pass Filter, Pass Band Insertion Loss | - | 18.8 | 18.8 | - | 1.76 | - | dB |
| High Pass Filter, Pass Band Return Loss | - | 17.4 | 20.3 | - | 18 | - | dB |
| Impedance | - | - | - | - | 50 | - | Ω |
| Isolation | - | 0 | 13.4 | - | 77 | - | dB |
| Isolation | - | 16.5 | 40 | - | 59 | - | dB |
| Low Band Center Frequency | - | - | - | - | 14.3 | - | GHz |
| Low Pass Filter, Pass Band Insertion Loss | - | 14.3 | 14.3 | - | 1.91 | - | dB |
| Low Pass Filter, Pass Band Return Loss | - | 13.2 | 15.4 | - | 24 | - | dB |
| Stopband Suppression, High Band | - | 0 | 13.4 | - | 57 | - | dB |
| Stopband Suppression, High Band | - | 21.9 | 40 | - | 51 | - | dB |
| Stopband Suppression, Low Band | - | 0 | 10.4 | - | 60 | - | dB |
| Stopband Suppression, Low Band | - | 16.5 | 40 | - | 55 | - | dB |
Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| DC Current, at any Port | 1.2 | A |
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
Package Information
| Parameter | Details | Rating |
|---|---|---|
| Dimensions | - | 3.10 x 4.10 mm |
Port Configuration and Functions
Port Diagram
A top-down view of the MDPX-00001CH package outline drawing is shown below.
Port Functions
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| GND | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Pad 1 | Input/Common | Pad 1 is the common port. This pad is DC short to ground and DC open to all other pads. |  |
| Pad 2 | RF High Band | Pad 2 is the high band pass filter. This pad is DC short to ground and is DC open to all other pads. | |
| Pad 3 | RF Low Band | Pad 3 is the low band pass filter. This pad is DC short to ground and is DC open all other pads. | |
Die Mounting Recommendations
Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
Bonding Diagram
Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Mechanical Data
Outline Drawing
Download : Outline 2D Drawing
NOTES: Unless Otherwise Specified
1. Material: CH Substrate is .004" Thick GaAs.
2. Finish: I/O traces and ground plane is 5 Microns Au.
3. Tolerance for X, Y dimensions are ±.002 in.
4. Tolerance for Z dimension is ±.0005 in.
5. Tolerance for pad location is ±.0001 in.
Revision History
| Revision Code | Revision Date | Comment |
|---|---|---|
| - | 2023-08-30 | Datasheet Initial Release |
| A | 2024-01-05 | Updated Production Test Criteria |
| B | 2024-02-20 | Updated Package Dimension |
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