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ATN10-0067CH
Passive GaAs MMIC DC - 67 GHz 10dB Attenuator
The ATN10-0067CH is part of a family of precision GaAs MMIC fixed attenuators. The ATN10-0067CH provides a nominal 10dB attenuation over a DC-67GHz operating range. These attenuators are an ideal solution for attenuating a signal and they can be used in a wide range of applications. They are ideal for test equipment’s protection and signal overload prevention in various RF systems. A 50-ohm match is maintained over the entire operating frequency range. ATN-67CH-KIT is an evaluation kit with 5 units of each value between 0dB to 10dB.
| Parameter | Typ | Unit |
|---|---|---|
| Frequency Range | 0 to 67 | GHz |
| Attenuation | 10 | dB |
| Return Loss | 38 | dB |
| Attenuation Flatness | 0.2 | dB |
Summary only – refer to the Electrical Specifications, Absolute Maximum Ratings, and Recommended Operating Range tables for complete details.
| Part Number | Description | Package | Green Status | Product Lifecycle | Export Classification |
|---|---|---|---|---|---|
| ATN10-0067CH | Passive GaAs MMIC DC - 67 GHz 10dB Attenuator | CH | RoHS REACH | Released | EAR99 |
Typical variation with bondwire lengths is shown for ATN06-0067CH, however general trends withincreasing bondwire lengths apply to all attenuators in the family.
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% visually inspected and RF performance is guaranteed by sample testing.
| Parameter | Test Conditions | Minimum Frequency (GHz) | Maximum Frequency (GHz) | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Frequency Range | - | 0 | 67 | - | - | - | GHz |
| Attenuation | - | 0 | 67 | - | 10 | - | dB |
| Attenuation Flatness | - | 0 | 67 | - | 0.2 | - | dB |
| Impedance | - | 0 | 67 | - | 50 | - | Ω |
| Return Loss | - | 0 | 35 | - | 36 | - | dB |
| Return Loss | - | 35 | 67 | - | 38 | - | dB |
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime.
| Parameter | Maximum Rating | Unit |
|---|---|---|
| DC Current at any Port | 100 | mA |
| Maximum Operating Temperature | 100 | °C |
| Maximum Storage Temperature | 125 | °C |
| Minimum Operating Temperature | -55 | °C |
| Minimum Storage Temperature | -65 | °C |
| RF Power Handling | 2 | W |
| Parameter | Details | Rating |
|---|---|---|
| ESD | 250 to < 500 Volts | HBM Class 1A |
| Dimensions | - | 0.60 x 0.60 mm |
A top-down view of the ATN10-0067CH package outline drawing is shown below. The MMIC attenuators are symmetrical allowing Port 1 or Port 2 to be used as the input.
| Port | Function | Description | DC Equivalent Circuit |
|---|---|---|---|
| Pad | Ground | CH package ground path is provided through the substrate and ground bond pads. |  |
| Port 1 | Input/Output | Port 1 and port 2 are DC connected to each other and ground through a T-network of resistors. |  |
| Port 2 | Input/Output | Port 1 and port 2 are DC connected to each other and ground through a T-network of resistors. | |
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. Bond wire inductance will improve return loss. Bondwire inductance in the range of 30pH to 200pH will improve performance.
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
Bonding Diagram
Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
Download : Outline 2D Drawing
| Revision Code | Revision Date | Comment |
|---|---|---|
| A | 2024-01-05 | Updated Production Test Criteria |
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